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Title:
ULTRASONIC PROBE MANUFACTURING METHOD, ULTRASONIC PROBE AND ULTRASONIC IMAGE PICKUP DEVICE
Document Type and Number:
Japanese Patent JP2002177271
Kind Code:
A
Abstract:

To provide an ultrasonic probe capable of providing stable adhesive force among each of members to be laminated, a manufacturing method of such ultrasonic probe and an ultrasonic image pickup device using such ultrasonic probe.

At least one surface out of adhesive surfaces of the members is surface-worked by an excimer laser at the time of integrating an acoustic lens 512, an acoustic matching member 510, an ultrasonic transducer (piezoelectric member) 302, a film 502 and a packing member 702 by laminating and adhering them.


Inventors:
AOKI HIROYUKI
NOZAKI MITSUHIRO
Application Number:
JP2000372665A
Publication Date:
June 25, 2002
Filing Date:
December 07, 2000
Export Citation:
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Assignee:
GE MED SYS GLOBAL TECH CO LLC
International Classes:
G01N29/24; A61B8/00; H04R17/00; H04R31/00; (IPC1-7): A61B8/00; G01N29/24; H04R17/00; H04R31/00
Domestic Patent References:
JPH06201664A1994-07-22
JPH0865794A1996-03-08
JPH10308997A1998-11-17
JPH10126889A1998-05-15
JPH0730999A1995-01-31
JPH11226012A1999-08-24
JPH10253604A1998-09-25
JP2000050391A2000-02-18
JP2000143335A2000-05-23
JP2000307162A2000-11-02
JP2000028595A2000-01-28
JP2000217817A2000-08-08
JPH08319174A1996-12-03
JPH0737107U1995-07-11
Attorney, Agent or Firm:
Fujishima Ijima (1 outside)