Title:
ULTRASONIC SENSOR AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016013146
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an ultrasonic sensor in which reliability is improved by withdrawing wiring efficiently from elements arranged in the array-shape, and a method of manufacturing the same.SOLUTION: An ultrasonic sensor comprises a plurality of ultrasonic elements having first electrodes 14, piezoelectric material layers 15 and second electrodes 16 from a substrate 11 side, and arranged in the first direction and the second direction. The second electrodes 16 are provided continuously in the ultrasonic element rows arranged in parallel in the first direction. The first electrodes 14 are provided continuously in the ultrasonic element rows arranged in parallel in the second direction. The piezoelectric material layer 15 is provided for each ultrasonic element along the second direction. The ultrasonic elements are connected to each other in the first direction via connection parts 22 extended in the first direction. A piezoelectric material layer removal part 21 from which the piezoelectric material layer 15 is removed exists between the connection parts 22. The second electrodes 16 are provided in regions of the connection part 22 and the piezoelectric material layer removal part 21.
Inventors:
KOJIMA CHIKARA
Application Number:
JP2014135134A
Publication Date:
January 28, 2016
Filing Date:
June 30, 2014
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
A61B8/00; G01N29/24; H01L41/047; H01L41/09; H01L41/113; H01L41/29; H01L41/332; H04R17/00; H04R31/00
Domestic Patent References:
| JP2006025805A | 2006-02-02 | |||
| JPS61114178A | 1986-05-31 | |||
| JPS646858A | 1989-01-11 |
Foreign References:
| US20050124884A1 | 2005-06-09 |
Attorney, Agent or Firm:
Hiroyuki Kurihara