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Title:
ULTRASONIC TRANSDUCER ELEMENT CHIP, PROBE, ELECTRONIC APPARATUS, AND ULTRASONIC DIAGNOSTIC DEVICE
Document Type and Number:
Japanese Patent JP2016106500
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an ultrasonic transducer element chip that is thin and has strength to withstand pressing force in a thickness direction of a substrate.SOLUTION: Openings are disposed in an array on a substrate. Ultrasonic transducer elements are provided to the respective openings on a first surface of the substrate. A reinforcement member 52 is fixed to a second surface of the substrate opposite to the first surface. Grooves 53 are formed on a surface of the reinforcement member 52. The grooves 53 are disposed at an interval L smaller than opening width S.SELECTED DRAWING: Figure 5

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Inventors:
NAKAMURA TOMOAKI
TSURUNO JIRO
KIYOSE SETSUNAI
Application Number:
JP2016047228A
Publication Date:
June 16, 2016
Filing Date:
March 10, 2016
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H04R17/00; A61B8/14; H04R31/00
Domestic Patent References:
JP2011139295A2011-07-14
JP2007178221A2007-07-12
JP2007195248A2007-08-02
JP2011082624A2011-04-21
JPS63135609U1988-09-06
Attorney, Agent or Firm:
Inoue Ichi
Takekoshi Noboru
Yasushi Kuroda



 
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