Title:
超音波送受信デバイス及びそれを用いた超音波探触子
Document Type and Number:
Japanese Patent JP4958631
Kind Code:
B2
Abstract:
The present invention provides an ultrasonic transducer device to send and receive ultrasonic waves, comprising a semiconductor substrate, a lower electrode disposed on the semiconductor substrate, a gap disposed on the lower electrode, a third insulation film disposed on the gap, an upper electrode disposed on the third insulation film, a fourth insulation film disposed on the upper electrode, a wiring layer disposed on the fourth insulation film, and a fifth insulation film disposed on the wiring layer. The upper electrode is electrically connected to the wiring layer with penetrating wires.
Inventors:
Tamotsu Yoshimura
Tatsuya Nagata
Tatsuya Nagata
Application Number:
JP2007128020A
Publication Date:
June 20, 2012
Filing Date:
May 14, 2007
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H04R19/00; A61B8/00
Domestic Patent References:
| JP2007074263A | ||||
| JP2004247520A | ||||
| JP2006094459A | ||||
| JP61220596A | ||||
| JP2006015137A | ||||
| JP2003500955A | ||||
| JP2007074045A | ||||
| JP2006211185A | ||||
| JP2006352808A |
Foreign References:
| WO2007046180A1 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation