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Title:
ULTRASONIC VIBRATOR UNIT AND ULTRASONIC PROBE
Document Type and Number:
Japanese Patent JP2011182140
Kind Code:
A
Abstract:

To provide an ultrasonic vibrator unit which can suppress the generation of stress in the whole of an intervened member intervened between a vibrating film and a substrate, a fixed portion between the vibrating film and the substrate, and the vibrating film and the substrate, also can eliminate a step of forming a sacrifice layer and a step of piercing, hardly damages the vibrating film resulting from gas etching, and can be manufactured at a high repeatability, high reliability and simplified step, and an ultrasonic probe.

In the ultrasonic vibrator unit in which a plurality of ultrasonic vibrators which include a substrate side electrode provided at one face side of the substrate, the vibrating film disposed so as to have one face opposing the substrate side electrode, and a film side electrode provided on the other face of the vibrating film are provided on the substrate, the substrate side electrode is embedded in the substrate so that a part of the substrate side electrode exposes to one face of the substrate, and the metal intervened member is fixed between the vibrating film and the substrate by electrostatic attraction and chemical bonding.


Inventors:
LEE SEUNG-MOCK
Application Number:
JP2010043453A
Publication Date:
September 15, 2011
Filing Date:
February 26, 2010
Export Citation:
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Assignee:
INGEN MSL KK
International Classes:
H04R19/00; A61B8/00; B81B3/00; H01L29/84
Domestic Patent References:
JP2007215177A2007-08-23
JP2005103294A2005-04-21
Attorney, Agent or Firm:
Nobuyuki Yamaguchi
Yoshiaki Morisada