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Patent Searching and Data


Title:
ULTRAVIOLET-CURING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0733959
Kind Code:
A
Abstract:

PURPOSE: To obtain an ultraviolet-curing resin compsn. which is excellent in flexibility and adhesion to a conductor without lowering the heat resistance and is useful for electric wire sheathing, heat-resistant film, etc.

CONSTITUTION: The title compsn. comprises (A) a polyethylene terephthalate resin having a melting point of above 170°C, (B) a satd. copolyester having a melting point or a softening point of 100 to 160°C, (C) a cationically polymerizing compd. consisting mainly of an epoxy resin, and (D) a photopolymerization initiator which liberates a Lewis acid when irradiated with an ultraviolet ray. Component (B) is used in 0.05 to 20 pts.wt. per 100 pts.wt. of component (A). Component (C) is used in 5 to 50 pts.wt. per 100 pts.wt. in total of components (A) and (B), and component (D) is used in 0.05 to 10 pts.wt. per 100 pts.wt. of component (C).


Inventors:
KOMADA MEGUMI
NAKANO MASAYOSHI
Application Number:
JP18265593A
Publication Date:
February 03, 1995
Filing Date:
July 23, 1993
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08G59/68; C08G59/00; C08L63/00; (IPC1-7): C08L63/00; C08G59/68
Attorney, Agent or Firm:
Hajime Tsukuni (1 person outside)