Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
UNBINDING DEVICE FOR RING-SHAPED WIRE BUNDLE
Document Type and Number:
Japanese Patent JP2002274753
Kind Code:
A
Abstract:

To provide an unbinding device for a ring-shaped wire bundle capable of surely preventing the unbalancing of the wire bundle and smoothly taking out the wire material in taking out the wiring material by unbinding the ring- shaped wire bundle.

In this ring-shaped wire bundle unbinding device wherein a support 13 is stood on a pedestal 11, plural guide grooves 15 are formed on the pedestal in a state of outwardly radially extended from the support, basic ends 17a-23a of twelve pieces of guide rod members 17-23 are supported on a head part of the support, their free ends 17b-23b are movably inserted into the guide grooves, each guide rod member is expanded to the support like an umbrella rib, and the guide rod members are energized to expand and support a central hole of the ring-shaped wire bundle placed on the pedestal 11 through the supported at the free ends 17b-23b, each guide rod member is made of a rigid rod member, the head part of the support is provided with an energizing mechanism 25 for energizing the guide rod members, and the basic ends of the guide rod members are supported by the energizing mechanism 25.


Inventors:
KIHARA ETSURO
Application Number:
JP2001074249A
Publication Date:
September 25, 2002
Filing Date:
March 15, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FURUKAWA ELECTRIC CO LTD
FURUKAWA AUTOMOTIVE PARTS INC
International Classes:
B65H57/18; (IPC1-7): B65H57/18
Domestic Patent References:
JPH07277595A1995-10-24
JPH0215886Y21990-04-27
JPS60154348U1985-10-15
JPS62133566U1987-08-22