Title:
UNDERCOATING MATERIAL FOR VACUUM DEPOSITION AND METALLIZED MOLDING
Document Type and Number:
Japanese Patent JP3282312
Kind Code:
B2
Abstract:
PURPOSE: To obtain an undercoating material for vacuum deposition, excellent in adhesion to various kinds of substrates, especially to a polypropylene resin which has been used to be unsuitable for a metallized molding up to today and an excellent metallized molding produced by using the same undercoating material.
CONSTITUTION: There are provided active energy rays curing undercoating material for vacuum deposition and a metallized molding composed of a substrate, the above-mentioned undercoating material for vacuum deposition and a metallized layer. This undercoating material for vacuum deposition is composed of (A) 20 to 70wt.% copolymer synthesized by copolymerizing 5 to 50wt.% one or more kinds of monomers selected from an amino(meth)acrylate and amino(meth)acrylamide, 50 to 95wt.% styrene-related monomer and 0 to 45wt.% α,β-unsaturated monomer copolymerizable therewith and having 5000 to 50000 weight-average molecular weight, (B) 30 to 80wt.% reactive diluent, (C) 0 to 10wt.% additive and (D) 0 to 20wt.% photopolymerization initiator.
Inventors:
Toshiyuki Imai
Shinichi Katayama
Keizo Matsumoto
Shinichi Katayama
Keizo Matsumoto
Application Number:
JP24067893A
Publication Date:
May 13, 2002
Filing Date:
August 31, 1993
Export Citation:
Assignee:
Arakawa Chemical Industry Co., Ltd.
International Classes:
C09D4/00; C09D4/06; C09D5/00; C09D125/00; C09D125/04; C09D133/02; C09D133/04; C09D133/14; C09D133/26; (IPC1-7): C09D133/14; C09D4/06; C09D5/00; C09D125/04; C09D133/26
Domestic Patent References:
| JP3215543A | ||||
| JP6131476A | ||||
| JP5823812A | ||||
| JP748524A | ||||
| JP718203A | ||||
| JP69847A |
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