Title:
UNDERCUT PROCESSING MECHANISM AND PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2017056474
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an undercut processing mechanism capable of preventing a processing defect of an undercut part, and a processing device.SOLUTION: The present invention relates to an undercut processing mechanism 1 which is attached for use to a processing device processing a workpiece 91 having an undercut part 93 and can form the undercut part 93, the undercut processing mechanism comprising: a movable die 11 which can move and forms the undercut part 93 in processing; moving means 21 of moving the movable die 11 off from the undercut part 93 after the processing; and a die plate 61 supporting the movable die 11 such that the movable die 11 does not move during the processing.SELECTED DRAWING: Figure 5
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Inventors:
SORIMOTO MASANORI
Application Number:
JP2015183548A
Publication Date:
March 23, 2017
Filing Date:
September 17, 2015
Export Citation:
Assignee:
TECHNOCRATS CORP
International Classes:
B21D37/08; B21D19/00; B21D19/08
Attorney, Agent or Firm:
Hiroshi Keitokuin
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