Title:
アンダーフィル材、電子部品装置及び電子部品装置の製造方法
Document Type and Number:
Japanese Patent JP7454906
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an underfill material that prevents cracking of a solder resist in reflowing, and has excellent temperature cycle resistance.SOLUTION: An underfill material contains (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler. When made into a cured product, the underfill material shows a thermal expansion coefficient of 30 ppm/°C or less, at a glass transition temperature or lower, measured by TMA (thermomechanical analysis), and shows a storage elastic modulus of 0.10 GPa or less, at 240°C, measured by DMA (dynamic mechanical analysis).SELECTED DRAWING: None
Inventors:
Hisato Takahashi
Yuma Takeuchi
Yuma Takeuchi
Application Number:
JP2016202715A
Publication Date:
March 25, 2024
Filing Date:
October 14, 2016
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
C08L63/00; C08G59/10; C08G59/24; C08G59/32; C08G59/50; C08K3/013; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2012149111A | ||||
| JP5262855A |
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office