Title:
下層膜形成用組成物、レジストパターン形成方法、電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP7301152
Kind Code:
B2
Abstract:
The present invention provides a composition for forming an underlayer film, with which an underlayer film having excellent surface flatness and solvent resistance can be formed. In addition, the present invention provides a resist pattern forming method and a manufacturing method of an electronic device, which are related to the composition for forming an underlayer film. The composition for forming an underlayer film according to the present invention is a composition for forming an underlayer film, which is used for forming an underlayer film under a resist film, including a monomer or a polymer containing an aromatic ring and a halogen-based organic solvent, in which a content of the halogen-based organic solvent is 0.001 to 50 ppm by mass with respect to a total mass of the composition for forming an underlayer film.
Inventors:
Takeshi Kawabata
Kei Yamamoto
Kazuyoshi Mizutani
Kei Yamamoto
Kazuyoshi Mizutani
Application Number:
JP2021558325A
Publication Date:
June 30, 2023
Filing Date:
November 12, 2020
Export Citation:
Assignee:
Fujifilm Corporation
International Classes:
G03F7/11; G03F7/20
Domestic Patent References:
| JP2013156627A |
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mihashi
Fumio Mihashi