Title:
UNDERLAYER FILM FORMING COMPOSITION
Document Type and Number:
Japanese Patent JP2010026221
Kind Code:
A
Abstract:
To provide an underlayer film forming composition which is superior in suitability to embedding, ensures a small amount of a sublimate, and can form an underlayer film superior in etching resistance and having a good refraction coefficient and a good decay coefficient.
The underlayer film forming composition includes (A) a polymer having a predetermined structural unit, (B) a crosslinking agent having a butyl ether group, and (C) a solvent.
Inventors:
KONNO YOSUKE
MINEGISHI SHINYA
SATO MITSUHISA
MINEGISHI SHINYA
SATO MITSUHISA
Application Number:
JP2008187029A
Publication Date:
February 04, 2010
Filing Date:
July 18, 2008
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/11; C08F232/08; H01L21/027
Domestic Patent References:
| JP2007241259A | 2007-09-20 | |||
| JP2005015532A | 2005-01-20 | |||
| JP2002047430A | 2002-02-12 |
Foreign References:
| WO2006132088A1 | 2006-12-14 |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Chongqing Sugano
Koji Kikawa
Chongqing Sugano
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