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Title:
UNIT TILE
Document Type and Number:
Japanese Patent JP2001234623
Kind Code:
A
Abstract:

To provide a unit tile which is excellent in adhesion between a building skelton and a tile, allows joint correction at the time of installation of the tile, and can reduce the manufacturing cost by decreasing the amount of resin to be used by solving the problem in the unit tile formed by connecting the conventional tiles.

This unit tile is characterized in that at the back and/or side of the tile, the tiles are connected by resin having a width and a thickness of 3 mm or less. The unit tile is characterized in that at the back and/or side of tiles, molded resin is thermocompression-bonded to connect the tiles. The unit tile is characterized in that the back and/or side of the tile is provided with a groove, and resin is embedded in the grooves to connect the tiles.


Inventors:
TAKADA TAKASHI
FUJIWARA TSUNEO
Application Number:
JP2000047261A
Publication Date:
August 31, 2001
Filing Date:
February 24, 2000
Export Citation:
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Assignee:
CHIYUUNOU SETETSUKU KK
International Classes:
E04F13/08; (IPC1-7): E04F13/08
Attorney, Agent or Firm:
Ban Toshimitsu



 
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