Title:
UNSATURATED GROUP CONTAINING CARBOXYLIC ACID RESIN COMPOSITION AND SOLDER RESIST RESIN
Document Type and Number:
Japanese Patent JP3241452
Kind Code:
B2
Abstract:
PURPOSE: To provide a photosensitive thermosetting resin compsn. and a solder resist pattern with which a hardened coating film having excellent adhesion property, electric insulating property, resistance to galvanic corrosion, and heat resistance for soldering which are required as a solder resist, and having whitening resistance against a water-soluble flux for a leveller, durability against solvent such as methylene chloride, acid and alkali resistance, plating resistane, and excellent PCT(pressure cook test) property, so that the compsn. is suitable for the production of printed circuit boards for consumer and industry.
CONSTITUTION: The unsatd. group-contg. carboxylic acid resin compsn. is obtd. by the reaction of a polybasic acid anhydride with an unsatd. group-contg. resin which is obtd. by the reaction of a compd. expressed by formula and a compd. having active hydrogen. The solder resist resin compsn. contains this resin. In the formula, Ar is C4-C20 aromatic hydrocarbon group having at least one glycidyloxyl group, and R is a hydrogen atom or methyl group.
Inventors:
Yoichi Ohba
Yamada Iwasa
Yamada Iwasa
Application Number:
JP24013592A
Publication Date:
December 25, 2001
Filing Date:
August 18, 1992
Export Citation:
Assignee:
Asahi Chemical Laboratory Co., Ltd.
International Classes:
G03F7/004; C08F299/02; C08G59/14; G03F7/038; H05K3/06; H05K3/28; (IPC1-7): G03F7/038; C08F299/02; C08G59/14; H05K3/06; H05K3/28
Domestic Patent References:
| JP4953988A | ||||
| JP63142036A | ||||
| JP61161248A | ||||
| JP61162519A | ||||
| JP497361A | ||||
| JP4225355A |
Attorney, Agent or Firm:
Eiichi Kume