PURPOSE: To provide a new compound highly soluble to organic solvent, to be served as a raw material for laminates for use in the electrical and electronic fields, sealers, electrical insulating materials, sliding materials and other molding materials etc., useful in the form of cured product excellent in heat resistance, low water absorptivity and flexibility.
CONSTITUTION: The compound of formula I (Q is divalent organic group; A1 is of formula II, etc.; A2 is of formula III, etc.; A3 is of formula IV, etc.; R1-R6 are each H, halogen, hydrocarbon, etc.; D is divalent unsaturated organic group; x and y are each 0-10; p, q, r and s are each 1-20; t is 0 or 1), e.g. N,N'-bis(4- aminophenoxyphenyl)methanebismaleimide. The compound of the formula I can be obtained by reaction of an aromatic amino compound of formula V (B1 is of formula VI, etc.; B2 is of formula VII, etc.; B3 is of formula VIII, etc.) with an unsaturated dicarboxylic anhydride of formula IX. The compound of the formula I can be cured by mixing with a polyamine optionally in a molten state followed by press molding.
TAKEBE KAZUO
SHIBATA MITSUHIRO
KANEKAWA SHUICHI
