PURPOSE: The titled composition for use in blister resin molds, having an increased softening point, a high dimensional stability in heating and cooling, a light weight, and excellent surface hardness and chemical resistance, prepared by mixing an unsaturated polyester resin with glass fiber, TiO2 powder, and a mold release.
CONSTITUTION: The titled resin composition is prepared by mixing 100pts.wt. unsaturated polyester resin (e.g., polybutylene terephthalate resin) with 20W 50pts.wt. glass fiber, 20W50pts.wt. TiO2 powder and 0.2W2pts.wt. mold release (e.g., zinc stearate) as principal components. Said resin composition, when cured, can provide an unsaturated polyester resin composition having a softening point which is by at least 30°C above that of a cured product of the unsaturated polyester resin. A gypsum mold is formed by using a previously formed wood mold for blister package as a male mold. The above heat-resistant unsaturated polyester resin composition is poured into the gypsum mold as a female mold and cured at room temperature or by heating. After curing, it is removed and used as such or after polishing as a resin mold for blister package.
UENOYAMA NAGAHIRO
SHIGEMORI MASARU
