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Patent Searching and Data


Title:
UNSATURATED POLYESTER RESIN COMPOSITION AND MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2001335610
Kind Code:
A
Abstract:

To provide an unsaturated polyester resin composition whereby a molded product with an excellent heat-resistance of thermal deformation temperature ≥150°C can be obtained, even if the curing is performed at a relatively low temperature and a used mold is one used conventionally, and to provide a molded product which is excellent in heat-resistance and inexpensive.

The resin composition is obtained by dissolving an unsaturated polyester resin (a) of 50-70 pts.wt., which is obtained by reacting an acid component being α,β-unsaturated polybasic acid of 60-90 mol% and 2,6-naphthalene dicarboxylic acid compound or its derivative of 10-40 mol% with a polyhydric alcohol, in a polymerizable monomer (b) having one or more polymerizable double bond in a molecule of 30-50 pts.wt. (a total amount of (a) component and (b) component is adjusted to achieve 100 pts.wt.). A glass fiber reinforced plastic molded product comprises the resin composition and a glass substrate.


Inventors:
IZUMI HIROFUMI
NUMAO KAZUYUKI
Application Number:
JP2000158417A
Publication Date:
December 04, 2001
Filing Date:
May 29, 2000
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08J5/04; C08F283/01; C08G63/52; (IPC1-7): C08F283/01; C08G63/52; C08J5/04