Title:
UPRIGHT THERMAL INSULATING DEVICE
Document Type and Number:
Japanese Patent JP2004010153
Kind Code:
A
Abstract:
To provide a thermal insulating device having such a structure disassemblable when not encasing contents and having a removable door.
In the upright thermal insulating device, panels 1-6 that constitute the respective wall surfaces of a cuboid are formed of a laminated material of a reinforcing material, a vacuum thermal insulating material and an outer covering material, and a soft material is arranged on their outer peripheral edges, while the panels are fixed in such a state that there is no clearance mutually between them.
Inventors:
NAKA REIJI
TSUKIOKA KENICHIRO
NAKAJIMA NORIO
TSUKIOKA KENICHIRO
NAKAJIMA NORIO
Application Number:
JP2002168841A
Publication Date:
January 15, 2004
Filing Date:
June 10, 2002
Export Citation:
Assignee:
EKUSEBUN KK
International Classes:
B65D6/10; A47J39/02; A47J41/00; A47J47/14; B65D6/24; B65D63/16; B65D81/38; (IPC1-7): B65D81/38; A47J39/02; A47J47/14; B65D63/16
Attorney, Agent or Firm:
Kenji Yoshitake
Masami Tamama
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Masami Tamama
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
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