Use of CsOH in dielectric CMP slurry - CABOT MICROELECTRONICS CORPORATION

Title:

Use of CsOH in dielectric CMP slurry

Document Type and Number:

Japanese Patent JP6030703

Kind Code:

B2

Abstract:

Chemical mechanical polishing compositions including an abrasive and cesium hydroxide and methods for polishing dielectric layers associated with integrated circuits using cesium hydroxide containing polishing compositions.

Inventors:

Walters, Alicia F.
Mueller, Brian El.
Darksen, James A.
Finney, Paul M.

Application Number:

JP2015094245A

Publication Date:

November 24, 2016

Filing Date:

May 01, 2015

Export Citation:

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Assignee:

CABOT MICROELECTRONICS CORPORATION

International Classes:

B24B57/02; B24B37/00; C09K3/14; C09G1/02; H01L21/304; H01L21/3105; H01L21/306

Domestic Patent References:

JP9316431A

Attorney, Agent or Firm:

Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno

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