To provide an electrostatic capacity type touch pad which uses thin films for cost reduction, and its manufacturing process.

The electrostatic capacity type touch pad is equipped with a sheet of a thin film layer and a sheet of a printed circuit board. The thin film has traces in two directions, and the printed circuit board has a first conductive layer and a second conductive layer on both sides of a ground plane. Bonding pads the first conductive layer has are joined to the traces in the two directions, and further connected to the first conductive layer and a second conductive layer through vias. The manufacture of the electrostatic capacity type touch pad is divided into that of the thin film and that of the printed circuit board. Jointing is performed with a conductive adhesive, or a thin film is printed on a printed circuit board as a substrate.