ポリアミド成形材料の使用、印刷可能であるか又は印刷された物品、複合部材及びその製造法 - エボニック Degussa AG ゲーエムベーハー Evonik Degussa GmbH

Title:

ポリアミド成形材料の使用、印刷可能であるか又は印刷された物品、複合部材及びその製造法

Document Type and Number:

Japanese Patent JP5558650

Kind Code:

B2

Abstract:

Use of polyamide molding mass comprising polyamide (A) (90 parts by weight) obtained from lactam and/or amino carboxylic acid with at least 10C atoms and polyamide, PA 1010 (B1) (10-100 parts by weight), for the production of printable or printed articles. An independent claim is included for: (1) a printable or printed article comprising the molding mass; (2) a composite part comprising the foil and a substrate; and (3) preparing a composite part by gluing, rear injection, co-extrusion, plastering, laminating, rear pressing or rear foaming and by subsequent transforming.

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Inventors:

Kirsten Al Tyng
Francis * Ehrlich Baumann
Sonja Bormann
Andreas Dove
Lorant ヴルシェ
George Shaffer

Application Number:

JP2006158992A

Publication Date:

July 23, 2014

Filing Date:

June 07, 2006

Export Citation:

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Assignee:

エボニック Degussa AG ゲーエムベーハー Evonik Degussa GmbH

International Classes:

C08L77/06; A63C5/14; B32B27/34; C08J5/18; C08L77/02; C08L77/04

Attorney, Agent or Firm:

Toshio Yano
Takuya Kuno
アインゼル Felix-Reinhardt

Previous Patent: JPS5558649

Next Patent: JPS5558651