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Title:
Use of the polyolefin closure film covered with the nonresponsive hot melt adhesive for closure
Document Type and Number:
Japanese Patent JP5976007
Kind Code:
B2
Abstract:
Sealing a building and civil engineering works or building construction comprises: (a) coating a flexible polyolefin sealing film (1) with a non-reactive hot-melt adhesive composition (2) to form a hot-melt adhesive-coated polyolefin sealing film, which is tack-free at 25[deg] C; (b) placing the hot-melt adhesive-coated polyolefin sealing film onto the surface (4) of a building (5) of the civil engineering works or building construction; (c) supplying heat under melting of the non-reactive hot-melt adhesive composition; and (d) cooling the non-reactive hot-melt adhesive composition. Sealing a building and civil engineering works or building construction comprises: (a) coating a flexible polyolefin sealing film (1) with a non-reactive hot-melt adhesive composition (2) to form a hot-melt adhesive-coated polyolefin sealing film, which is tack-free at 25[deg] C; (b) placing the hot-melt adhesive-coated polyolefin sealing film onto the surface (4) of a building (5) of the civil engineering works or building construction; (c) supplying heat under melting of the non-reactive hot-melt adhesive composition; and (d) cooling the non-reactive hot-melt adhesive composition to form an adhesive bond between the flexible polyolefin sealing film and the surface of the structure, where the non-reactive hot-melt adhesive composition is free of epoxy resin. An independent claim is also included for a layer composite body (8) comprising (i) layer of a polyolefin film sealing foil, (ii) layer of a hot-melt adhesive composition and (iii) building and civil engineering works or building construction, where the layer of hot-melt adhesive composition is arranged between the layer of polyolefin film and sealing foil of the building and civil engineering works or building construction.

Inventors:
Martin Linnenbrink
Doreen Yanke
Application Number:
JP2013543769A
Publication Date:
August 23, 2016
Filing Date:
December 14, 2011
Export Citation:
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Assignee:
Seeker Technology AG
International Classes:
C09J5/06; C09J7/00; C09J123/00; C09J123/08; C09J131/04; C09J157/00; C09J201/00; E04B1/66
Domestic Patent References:
JP50063083A
JP50063082A
JP2009138196A
JP2007176996A
JP2001026915A
JP10044325A
JP7026217A
Foreign References:
US20100256274
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe