Title:
安定化された熱可塑性ポリアミド成形材料の、光導波路のための被覆としての使用
Document Type and Number:
Japanese Patent JP2008513818
Kind Code:
A
Abstract:
The invention relates to the use of stabilized, thermoplastic polyamide molding compounds as a protective layer for coating optical waveguides possessing fluoride or fluoropolymer based cladding. The inventively used polyamide molding compound exhibits good adhesion to the fluoride or fluoropolymer based cladding. It also possesses a high permanent temperature resistance of at least 6000 hours at 125 °C. The current invention also relates to optical strands comprising at least one fiber core, single-layered or multi-layered cladding and at least one protective sleeve which encompasses the optical waveguide and which is made of stabilized, thermoplastic polyamide molding compounds.
Inventors:
St. Eppelmann, George
Bertram, Sabin
Andre, Starzell
Bertram, Sabin
Andre, Starzell
Application Number:
JP2007531710A
Publication Date:
May 01, 2008
Filing Date:
September 20, 2005
Export Citation:
Assignee:
EMS Chemie Actien Gezel Shaft
International Classes:
G02B6/44; C08J7/04; C09D7/12; C09D177/00; C09D201/00
Domestic Patent References:
| JP2004029823A | 2004-01-29 |
Attorney, Agent or Firm:
Takenori Hiroe
Takanobu Takekawa
High Shinichi Ara
Tsutomu Nishio
Hideaki Kamiya
Takanobu Takekawa
High Shinichi Ara
Tsutomu Nishio
Hideaki Kamiya