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Title:
【発明の名称】コイル・スパッタの分布を制御する回転コアを備えた可変インピーダンス回路の使用
Document Type and Number:
Japanese Patent JP2002510857
Kind Code:
A
Abstract:
Variable reactances in an impedance-matching box for an RF coil, in a plasma deposition system for depositing a film of sputtered target material on a substrate, can be varied by rotating inductor cores during the deposition process so that the RF coil and substrate heating, and the film deposition, are more uniform due to "time-averaging" of the RF voltage distributions along the RF coil.

Inventors:
Stimson, Bradley, Oh.
Smith, kenneth
Gopal Raja, Prabram
Application Number:
JP2000541716A
Publication Date:
April 09, 2002
Filing Date:
March 25, 1999
Export Citation:
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Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H05H1/46; C23C14/34; H01F21/06; H01F29/10; H01J37/32; H01J37/34; H01L21/203; H03H7/38; H03H7/40; (IPC1-7): H01L21/203; C23C14/34; H01F21/06; H01J37/32; H01J37/34; H03H7/40; H05H1/46
Attorney, Agent or Firm:
Yoshiki Hasegawa (1 person outside)