V溝加工方法および装置

Japanese Patent JP5355950

B2

There is provided a V-groove machining method and apparatus which, by measuring the depth of a V groove cut by a cutting tool and correcting the cutting depth of the cutting tool based on the measurement data, enables high precision machining of four-sided pyramids having vertices of a uniform height. The V-groove machining method includes the steps of: feeding a cutting tool relative to a workpiece in a first direction to create a first V groove, extending in the first direction, in the surface of the workpiece, and repeating this machining operation to create first V grooves at a predetermined pitch; moving the cutting tool along one of the first V grooves and scanning the first V groove with a distance sensor, disposed near the cutting tool, to measure the distance to the bottom of the first V groove, thereby detecting undulation of the bottom of the first V groove along the first direction; and feeding the cutting tool relative to the workpiece in a second direction orthogonal to the first direction to create a second V groove in the surface of the workpiece, and repeating this machining operation while correcting the position of the cutting tool in the machining position for each second V groove based on the results of detection of the undulation, thereby creating second V grooves at a predetermined pitch.

JPH01321142	TURNING METHOD OF NUMERICAL CONTROL LATHE
JP6209200	A manufacturing method of a step seal, seal structure, turbo machinery, and a step seal

Takanobu Akiyama
Satoshi Kato
Hiroyuki Kakishima
Kondo Junhisa

JP2008186041A

November 27, 2013

July 17, 2008

Click for automatic bibliography generation  

Toshiba Machine Co., Ltd.

B23B1/00; B23B5/14

JP2002036070A
JP2004249369A
JP2007320022A
JP2000094247A
JP2002011609A
JP5200653A

Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma

Previous Patent: JPS5355949

Next Patent: 液処理装置