To improve an abrasion resistive property, prevent occurrence of static electricity in a part contacted with an object to be held, and suppress adhesion of dust.

The vacuum chuck holder in a device for transporting and holding a semiconductor wafer has a part to be contacted with an object to be held. The contacted part has a sintered silicon carbide substrate and a chemical vapor deposition silicon carbide film is coated thereon. The chemical vapor deposition silicon carbide film has a ratio between a Miller indices indication (220) face orientation crystalline structure component and other face orientation crystalline structure component in X-ray diffraction intensity, of 32 times or more.