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Title:
VACUUM DEPOSITION DEVICE
Document Type and Number:
Japanese Patent JP2004137583
Kind Code:
A
Abstract:

To improve the utilizing efficiency of a vapor depositing material, to improve the quality of a thin film to be deposited, and to perform uniform vapor deposition to a substrate with a large area.

A vapor depositing source 10 consisting of stacked frame bodies 10A and 10B is adopted. A heating part 11 is formed by the frame body 10A of the bottom layer, and an evaporation flow control part 11 is formed by the frame body 10B of the other layer.


Inventors:
SAWADA YASUHIKO
YUKI TOSHIHISA
MURAYAMA TATSUFUMI
OGOSHI KUNIZO
ISHII KAZUO
Application Number:
JP2002305379A
Publication Date:
May 13, 2004
Filing Date:
October 21, 2002
Export Citation:
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Assignee:
PIONEER TOHOKU CORP
NIPPON STEEL CHEMICAL CO
International Classes:
C23C14/12; C23C14/24; H01L51/40; H01L51/50; H05B33/10; H01L51/56; (IPC1-7): C23C14/24; C23C14/12; H05B33/10; H05B33/14
Domestic Patent References:
JP2001273976A2001-10-05
JPH10204622A1998-08-04
JPH06228740A1994-08-16
JPH0269961U1990-05-28
JP2000160328A2000-06-13
JP2001247959A2001-09-14
JPH03287761A1991-12-18
Foreign References:
WO2002014575A12002-02-21
Attorney, Agent or Firm:
Nobujun Kobashi
Ritsumasa Kobashi