Title:
真空蒸着装置及び方法
Document Type and Number:
Japanese Patent JP4831841
Kind Code:
B2
Abstract:
In a vacuum vapor deposition method including a plurality of linear-shaped vaporization sources, equal-thickness surfaces (19a, 19b) are calculated for vaporization containers (8a, 8b), respectively. Each of the equal-thickness surfaces (19a, 19b) indicates where a deposition amount of vapor of a vaporization material released from release holes (13a, 13b) in the corresponding vaporization container (8a, 8b) is the same per unit time. Then, the vaporization containers (8a, 8b) are placed in such a manner that contact points of the respective equal-thickness surfaces (19a, 19b) all coincide with each other on a deposition surface of a substrate (4), each of the contact points being where the corresponding equal-thickness surfaces (19a, 19b) come in contact with the deposition surface of the substrate (4).
Inventors:
Yuji Yanagi
Application Number:
JP2009163239A
Publication Date:
December 07, 2011
Filing Date:
July 10, 2009
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
C23C14/24; H01L51/50; H05B33/10
Domestic Patent References:
| JP2007146219A | ||||
| JP2007046100A | ||||
| JP2003301255A | ||||
| JP2004327272A | ||||
| JP2005336527A |
Attorney, Agent or Firm:
Toshiro Mitsuishi
Tadahiro Mitsuishi
Yasuyuki Tanaka
Hiroshi Matsumoto
Tadahiro Mitsuishi
Yasuyuki Tanaka
Hiroshi Matsumoto