Title:
VACUUM DEPOSITION METHOD AND APPARATUS THEREFOR
Document Type and Number:
Japanese Patent JPH1180927
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a vacuum deposition method capable of executing deposition while easily preventing the deposition of films deposition in a chamber. SOLUTION: At the time of deposition on a resin substrate 1 within the chamber 2, an adhesion preventing body 14 integrally molded of a resin so as to cover the wall surface of the chamber 2 and the resin substrate is set in the chamber 2. The deposition is started and since the deposition is executed in this state, workability is good as compared to the case the deposition is executed by assembling a plural number of flat plates every time within the chamber like heretofore. Further, if the material of the adhesion preventing body 14 is made the same as the material of the resin substrate, the particularly high thin films may be formed on the resin substrate.
Inventors:
NAKANO YOSHIYUKI
SUEMITSU TOSHIYUKI
YOKOYAMA MASAHIDE
SUEMITSU TOSHIYUKI
YOKOYAMA MASAHIDE
Application Number:
JP23754297A
Publication Date:
March 26, 1999
Filing Date:
September 03, 1997
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C23C14/00; C23C14/24; (IPC1-7): C23C14/00; C23C14/24
Attorney, Agent or Firm:
Yoshihiro Morimoto