Title:
減圧乾燥装置及び減圧乾燥方法
Document Type and Number:
Japanese Patent JP6747815
Kind Code:
B2
Abstract:
Provided are a reduced-pressure drying device and a reduced-pressure drying method whereby a coating film can be dried in a stable manner, even when a vacuum pump for reducing pressure of a chamber section has been increased in capacity. Specifically, a reduced-pressure drying device for drying a coating film coated on a substrate in a reduced-pressure environment, wherein are provided a chamber section having a substrate-accommodating part in which a substrate is accommodated, and a suction pressure-reducing section for reducing the pressure in the substrate-accommodating part by suctioning the substrate-accommodating part, the chamber section having a reduced-pressure adjusting part for limiting the pressure-reducing rate of the suction pressure-reducing section to adjust the substrate-accommodating part to a predetermined pressure by supplying a gas to the substrate-accommodating part.
Inventors:
Shunichi Okamoto
Toru Ishiwatari
Toru Ishiwatari
Application Number:
JP2016017622A
Publication Date:
August 26, 2020
Filing Date:
February 02, 2016
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
International Classes:
F26B5/04; B05C9/12; F26B21/10
Domestic Patent References:
| JP2006194577A | ||||
| JP2015191880A | ||||
| JP2006261379A |