Title:
減圧乾燥装置
Document Type and Number:
Japanese Patent JP6886866
Kind Code:
B2
Abstract:
Provided is a reduced-pressure drying apparatus requiring a shorter time to complete a reduced-pressure drying process for a substrate. The reduced-pressure drying apparatus (1) for drying a solvent in an organic material film applied on a surface of a substrate (W) in a reduced pressure state comprises: a chamber (10) for containing the substrate, and a plurality of exhaust pipes (30) connecting to a space in the chamber (10) and connecting to an exhausting device (P) used for discharging gas in the chamber (10). Each of the plurality of exhaust pipes (30) has an APC valve (31) for freely closing the exhaust pipe (30) and includes the exhaust pipe (30) having a solvent collecting section, in which the solvent collecting section (32) for collecting the solvent vaporized from a solution on the substrate (W) is provided at a downstream of the APC valve (31), and the exhaust pipe (30) without the solvent collecting section is not provided with the solvent trapping section (21).
Inventors:
Akinori Shimamura
Teruyuki Hayashi
Teruyuki Hayashi
Application Number:
JP2017107517A
Publication Date:
June 16, 2021
Filing Date:
May 31, 2017
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
F26B5/04
Domestic Patent References:
| JP2014238194A | ||||
| JP2016102606A |
Attorney, Agent or Firm:
Tetsuo Kanamoto
Koji Hagiwara
Naoki Ogita
Koji Hagiwara
Naoki Ogita