PURPOSE: To make linearity excellent to the range of very low pressure and to improve excessively large pressure characteristics and temperature characteristics, by providing a strain yielding part between a peripheral thick fixed part and a central thick rigid part, and constituting said strain yielding part by strain yielding needles and a diaphragm part.

CONSTITUTION: A diaphragm shaped semiconductor pressure sensor 1 comprises a silicon diaphragm. The peripheral part of the sensor is a thick fixed part 11 and the central part is a thick rigid part 12. A strain yielding part is formed between the thick fixed part 11 and the thick rigid part 12. The strain yielding part comprises two strain yielding needles 13 having gage resistors and a diaphragm part 14, which is machined more thinly than the strain yielding needles 13. Each gage resistor of the strain yielding needles 13 comprises a P type diffused layer 15 and a second diffused layer 16, whose impurity concentration is higher than that of the diffused layer 15.