Title:
VACUUM HEAT-INSULATING PANEL
Document Type and Number:
Japanese Patent JP2022057322
Kind Code:
A
Abstract:
To provide a vacuum heat-insulating panel packaged by a heat-insulating holding packaging material which has a sealant layer having a small amount of gas discharge generated from the sealant layer itself, suppresses rise in an atmospheric pressure in an internal depressurized condition inside a vacuum heat-insulating panel due to degradation with time, and suppresses rise of thermal conductivity in a thickness direction of the vacuum heat-insulating panel.SOLUTION: A vacuum heat-insulating panel is composed of a core material for maintaining a shape and a heat-insulating holding packaging material for packaging the core material, in which heat conductivity in a thickness direction of the vacuum heat-insulating panel is 1 mW/mK or more and 35 mW/mK or less, the outer peripheral part of the vacuum heat-insulating panel is sealed with the heat-insulating holding packaging material 2, the heat-insulating holding packaging material 2 has a gas barrier base material layer 3 and a low gas dischargeable sealant layer 4, the low gas dischargeable sealant layer 4 contains a low gas dischargeable resin having heat sealability, and the low gas dischargeable resin has a density of 0.915 g/cm3 or more and 0.935 g/cm3 or less.SELECTED DRAWING: Figure 1
Inventors:
TAKEUCHI NAOYA
YAMAMOTO KAZUKI
TSUNEDA HIROTAKA
YAMAMOTO KAZUKI
TSUNEDA HIROTAKA
Application Number:
JP2020165507A
Publication Date:
April 11, 2022
Filing Date:
September 30, 2020
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B32B7/027; B32B27/00; B32B27/32; B65D81/38; F16L59/065
Attorney, Agent or Firm:
Junji Yuda
Noriyuki Takebayashi
Noriyuki Takebayashi