Title:
真空保持装置及びこれを用いた半導体ウェーハ研磨装置
Document Type and Number:
Japanese Patent JP6427445
Kind Code:
B2
Inventors:
Takuma Hosono
Application Number:
JP2015053168A
Publication Date:
November 21, 2018
Filing Date:
March 17, 2015
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
H01L21/304; B24B7/04; B24B41/06; F04F5/44; F15D1/02; H01L21/683
Domestic Patent References:
| JP2004200440A | ||||
| JP2007229846A | ||||
| JP2003202000A | ||||
| JP2007247626A |
Foreign References:
| EP2574796A1 |
Attorney, Agent or Firm:
Takamitsu Shimizu
Takakichi Hayashi
Takakichi Hayashi