VACUUM LAMINATION APPARATUS AND METHOD

Japanese Patent JP3243608

B2

PROBLEM TO BE SOLVED: To provide a vacuum laminate molding apparatus and method capable of degassing inferiority causing the generation of voids in a laminated molded product.
SOLUTION: A laminate molding apparatus is equipped with upper and lower plates 1, 2 provided in opposed relationship in a relatively approachable and separable manner, the film member 3 provided to the opposed surface of the lower plate 2, an electric heater 4 heating and melting the laminating material ha of a molding material H to be laminated, the bendable plate body 5 provided to the upper plate in opposed relation to the film member 3, a frame member 6 forming a laminate molding space K between the opposed surfaces of the upper and lower plates 1, 2, a pressure reducing means 7 reducing the pressure in the laminate molding space K, a close bonding/pressurizing means 8 closely bringing the film member 3 into contact with the film member 3 to the opposed surface of the lower plate 2 arbitrarily and separating the same from the opposed surface of the lower plate 2 to press the molding material H to be laminated to the plate member 5, a bracket 9 supporting the end part of the plate member 5 in a state movable by bending and a bending deformation means 10 subjecting the plate member to bending deformation.

Akihiko Ogawa
Katsuyuki Sakakibara

JP21278298A

January 07, 2002

July 28, 1998

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Meiki Seisakusho Co., Ltd.

B30B12/00; B29C43/10; B29C43/18; B29C43/20; B29C43/52; B29C43/56; B29C63/16; B29K105/06; B29L31/34; (IPC1-7): B29C43/20; B29C43/52; B29C43/56; B29C63/16; B30B12/00

JP8332646A
JP5163702A
JP63299894A
JP5309676A
JP6143311A
JP162014U

Nobuo Kaida (3 outside)

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