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Title:
VACUUM PLATING METHOD AND METAL EVAPORATING DEVICE
Document Type and Number:
Japanese Patent JPS57131362
Kind Code:
A
Abstract:

PURPOSE: To carry out plating of prescribed patterns on a base plate and improve the yield of evaporating metal by providing a sleeve having a through- hole at the top end of a crucible, maintaining the sleeve at high temp. thereby evaporating the metal from the crucible.

CONSTITUTION: A sleeve 7 having a through-hole 8 in a vertical direction is fitted to the top end of a crucible 2 provided with a heater 3 on the outside circumference. A heater 9 is provided on the outside of this sleeve 7, and both heaters 3, 9 are regulated to maintain the temp. of the sleeve 7 at temp. higher by ≥50°C than the temp. of the crucible 2. The metal 4 in the crucible 2 is heated to evaporate by using such metal evaporating device. Thereby, the sticking of the metal vapor evaporating in the crucible 2 on the inside wall of the through- hole 8 is prevented, and the stuck metal vapor evaporates instantaneously. The plating of the shape resembling to the sectional shape of the through-hole 8 is obtained on the base plate. Further, when the base plate is moved, the linear partial plating is obtained.


Inventors:
SAKAMOTO MUTSUO
Application Number:
JP1636181A
Publication Date:
August 14, 1982
Filing Date:
February 06, 1981
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C23C14/04; C23C14/24; (IPC1-7): C23C13/06; C23C13/12



 
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