Title:
真空処理装置
Document Type and Number:
Japanese Patent JP6647905
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of uniform processing with high reproducibility.SOLUTION: The vacuum processing apparatus includes: a vacuum pump 110 for exhausting a processing chamber; a controller 201 for controlling an introduction gas flow rate into the processing chamber; a flow rate tester 200 connected with the controller; a first exhaust tube 109 connecting between the vacuum pump and the processing chamber; and a second exhaust tube 111 arranged between the flow rate tester and a connection part A of the first exhaust tube. The magnitude of pressure loss from the flow rate tester 200 to the vacuum pump of exhausted tested gas is smaller than a difference between a predetermined pressure at test start with the flow rate tester and a pressure at an inlet of the vacuum pump.SELECTED DRAWING: Figure 2
Inventors:
Takahisa Hashimoto
Keitaro Ogawa
Shinichi Isozaki
Yosuke Sakai
Keitaro Ogawa
Shinichi Isozaki
Yosuke Sakai
Application Number:
JP2016027797A
Publication Date:
February 14, 2020
Filing Date:
February 17, 2016
Export Citation:
Assignee:
Hitachi High-Technologies Corporation
International Classes:
G01F25/00; H01L21/3065
Domestic Patent References:
| JP2012032983A | ||||
| JP2006012872A |
Attorney, Agent or Firm:
Polaire Patent Business Corporation