Title:
真空蒸着装置及び薄膜の形成方法
Document Type and Number:
Japanese Patent JP5697500
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus and a method for forming a thin film, capable of forming a thin film having a uniform thickness on a large-area substrate while highly efficiently using a thin film material.SOLUTION: The vacuum deposition apparatus 10a includes: evaporation sources 31-36 which generate vapor of the thin film material; a vacuum tank 11 in which a film forming object 51 is disposed; an evacuation device 12 which evacuates the inside of the vacuum tank 11; and a release device 21 to which the vapor is supplied from the evaporation sources 31-36 and which releases the vapor into the vacuum tank 11, in which the vapor is brought to the film forming object 51 while moving the release device 21 to form a thin film on the surface of the film forming object 51. The apparatus 10a further includes a moving device 15 for moving the evaporation sources 31-36 together with the release device 21.
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Inventors:
Yang Yang
Application Number:
JP2011058483A
Publication Date:
April 08, 2015
Filing Date:
March 16, 2011
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
C23C14/24; H01L51/50; H05B33/10
Domestic Patent References:
| JP2007146219A | ||||
| JP2003257644A | ||||
| JP2005154903A | ||||
| JP2011127217A |
Foreign References:
| WO2007135870A1 |
Attorney, Agent or Firm:
Shigeo Ishijima
Hideki Abe
Hideki Abe