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Patent Searching and Data


Title:
ベーパーチャンバ
Document Type and Number:
Japanese Patent JP6623296
Kind Code:
B2
Abstract:
Provided is a vapor chamber that is extremely thin but nonetheless allows a working fluid to smoothly flow back, prevents dry-out and provides a superior heat transport capability, regardless of an installation orientation such as a top heat orientation or a change in the installation orientation. A vapor chamber has a container having a hollow portion, the hollow portion being formed by one plate-shaped body and another plate-shaped body facing the one-plate shaped body; a working fluid enclosed in the hollow portion; a first wick structure provided in the hollow portion; and a second wick structure on an inner surface of the one plate-shaped body thermally connected to a heating element, the second wick structure having a lower flow path resistance to the working fluid than the first wick structure, the second wick structure including a groove portion, wherein a vapor flow path is provided inside of the other plate-shaped body, the first wick structure is provided between the other plate-shaped body and the second wick structure, and an aperture size of the first wick structure is 75% or more of a groove width of the second wick structure and an open area rate of the first wick structure is 35% or more.

Inventors:
Yoshikatsu Inagaki
Kenya Kawabata
Hirofumi Aoki
Application Number:
JP2018525284A
Publication Date:
December 18, 2019
Filing Date:
June 30, 2017
Export Citation:
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Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
F28D15/02; F28D15/04; H01L23/427; H05K7/20
Domestic Patent References:
JP2007315745A
JP2010151354A
JP2012184875A
Foreign References:
US20070240858
WO2008146129A2
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi