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Title:
VAPOR COMPRESSION TYPE HEAT PUMP DEVICE
Document Type and Number:
Japanese Patent JP2010002111
Kind Code:
A
Abstract:

To obtain a vapor compression type heat pump device allowing safe handling of a combustible refrigerant and safe repairing and disposal of it.

The vapor compression type heat pump device is provided with a refrigerant circuit formed by interconnecting a compressor 1, an outdoor heat exchanger 3, an expansion valve 4 and an indoor heat exchanger 7 by a refrigerant pipe; and an inside and outside connecting pipe connection fitting screw part 55 and a charging valve connection fitting screw part 57 provided in the refrigerant circuit and connected to a refrigerant recovery pipe 371 for recovering a refrigerant circulated in the refrigerant circuit. As the refrigerant, a combustible refrigerant is used, and the size of the inside and outside connecting pipe connection fitting screw part 55 and charging valve connection fitting screw part 57 is different from the size of a connection port provided in a conventional refrigerant circuit.


Inventors:
YABU SHIGEHIRO
KODA TOSHIHIDE
YAMASHITA KOJI
MAKINO HIROAKI
Application Number:
JP2008160550A
Publication Date:
January 07, 2010
Filing Date:
June 19, 2008
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
F25B45/00; F25B1/00; F25B43/02
Domestic Patent References:
JP2004116885A2004-04-15
JPH10176876A1998-06-30
JP2000292039A2000-10-20
JP2007315663A2007-12-06
JPH11336667A1999-12-07
JPS6011074A1985-01-21
JPH062965A1994-01-11
Attorney, Agent or Firm:
Hisao Kobayashi
Kiyoshi Yasushima
Souji Sasaki
Noboru Omura
Takanashi Norio



 
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