Title:
VAPOR COOLING DEVICE
Document Type and Number:
Japanese Patent JP2014038902
Kind Code:
A
Abstract:
To provide a vapor cooling device capable of reducing thermal resistance.
A vapor cooling device 1 includes: a refrigerant inclusion body 2 which has a hollow shape heat receiving section 3 for receiving heat from the outside, hollow shape radiator 4 emitting heat to the outside, and a refrigerant circulation part 5 for connecting inside of the heat receiving section 3 and inside of the radiator 4; and a refrigerant 6 which is enclosed in the refrigerant inclusion body 2, is stored in the heat receiving section 3, and conveys heat as latent heat. The refrigerant 6 is composed of mixed solution of perfluoro polyether and n-pentane. The content of the n-pentane on the mixed solution is 40 to 60 mass%.
Inventors:
KURIBAYASHI TAIZO
MATSUSHIMA SEIJI
MATSUSHIMA SEIJI
Application Number:
JP2012179343A
Publication Date:
February 27, 2014
Filing Date:
August 13, 2012
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
H01L23/427; F28D15/02; H05K7/20
Domestic Patent References:
| JP2006307170A | 2006-11-09 | |||
| JP2008519113A | 2008-06-05 | |||
| JP2011155107A | 2011-08-11 | |||
| JP2010196912A | 2010-09-09 |
Attorney, Agent or Firm:
Akira Watanabe
Einosuke Kishimoto
Matsumura Naoto
Einosuke Kishimoto
Matsumura Naoto