Title:
VAPOR DEPOSITION APPARATUS
Document Type and Number:
Japanese Patent JP2021147662
Kind Code:
A
Abstract:
To provide a vapor deposition apparatus with a simple constitution capable of suppressing a breakage of a substrate attributed to an adhesion between a clamp and a substrate due to a vapor deposition film.SOLUTION: A vapor deposition apparatus for depositing a vapor deposition film on a substrate with a predetermined thickness in multiple vapor deposition processes includes: a vapor deposition part for forming the vapor deposition film on the substrate; a mounting part for mounting the substrate; and a fixing part having an abutting part for abutting to a peripheral edge part of the substrate and fixing the substrate on the mounting part by the abutting part. Each of multiple vapor deposition processes is performed such that an abutting position of the abutting part becomes more outside in a plane parallel to the substrate than in the previous process.SELECTED DRAWING: Figure 3
Inventors:
TAKAHASHI MASASHI
CHIBA ATSUSHI
CHIBA ATSUSHI
Application Number:
JP2020048444A
Publication Date:
September 27, 2021
Filing Date:
March 18, 2020
Export Citation:
Assignee:
LAPIS SEMICONDUCTOR CO LTD
International Classes:
C23C14/34
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office