Title:
VAPOR DEPOSITION SOURCE AND VAPOR DEPOSITION SYSTEM PROVIDED THEREWITH
Document Type and Number:
Japanese Patent JP2006152441
Kind Code:
A
Abstract:
To provide a vapor deposition source having a fixed vapor deposition rate and having satisfactory reproducibility, and to provide a vapor deposition system provided therewith.
The vapor deposition source is provided with: heating vessels 13, 23 each having an opening; and covers 15, 25 coupled to each opening of the heating vessels 13, 23, and in which a plurality of holes 17, 27 are formed along the longitudinal direction of each opening of the heating vessels 13, 23, and along the longitudinal direction of each opening part in the heating vessels 13, 23, the distance between the mutually adjacent holes 17, 27 formed at the covers 15, 25 changes.
Inventors:
KIM DOKON
AN SAIKO
SO KANSHO
KYO MEISHU
TEI SHAKUKEN
AN SAIKO
SO KANSHO
KYO MEISHU
TEI SHAKUKEN
Application Number:
JP2005343974A
Publication Date:
June 15, 2006
Filing Date:
November 29, 2005
Export Citation:
Assignee:
SAMSUNG SDI CO LTD
International Classes:
C23C14/24; H01L51/50; H05B33/10
Attorney, Agent or Firm:
Miaki Kametani
Tetsuo Kanamoto
Tetsuo Kanamoto