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Title:
VAPOR PHASE TYPE SOLDERING DEVICE
Document Type and Number:
Japanese Patent JPS62151268
Kind Code:
A
Abstract:

PURPOSE: To reduce an outflow leakage vapor quantity by providing a conveyor frame whose interval can be adjusted in accordance with the change of the width size of a printed circuit board, and also providing an opening/closing plate for abutting on carrying-in port and carrying-out port parts.

CONSTITUTION: A carrying conveyor 33 is provided between the carrying-in part 21 and the carrying-out part 22 of the printed circuit board, and also the conveyor frame of the conveyor 33 is installed so as to be freely slidable. Also, the opening/closing plate 82 is provided integrally with the conveyor frame, on the outside opening surface 81 of the carrying-in port and carrying-out port parts 21, 22, and also the opening/closing plate 82 is opened and closed by interlocking with the change of width of the conveyor frame. By following the change of the width size of the circuit board, the interval of the conveyor frame is adjusted by operating a handle, and also, by interlocking with it, the opening/closing plate 82 is moved and adjusted, and the leakage of vapor from the opening surface 81 is reduced. Accordingly, the leakage outflow quantity of an expensive vapor can be reduced.


Inventors:
ABE NOBUHIDE
TAKAHASHI TAKAO
KAKIHARA KATSUYUKI
Application Number:
JP1985000294381
Publication Date:
July 06, 1987
Filing Date:
December 26, 1985
Export Citation:
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Assignee:
TAMURA SEISAKUSHO KK
International Classes:
H05K3/34; B23K1/015; (IPC1-7): B23K3/04; H05K3/34



 
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