To provide a variable capacitance capacitor, that is made to be mounted easily and surely on a mother board by making the formation of solder bumps easier, without compromising the electrical characteristics of the bumps and, in addition, to withstand operating environments by ensuring reliability of moisture resistance.

This variable capacitance capacitor is constituted by successively forming a lower electrode layer 12, a thin dielectric layer 13, an upper electrode layer 14, and a protective layer 18 having an opening 110, through the parts of which the lower and upper electrode layers 12 and 14 are exposed on a support substrate 11. On the parts of the lower and upper electrode layers 12 and 14 exposed through the opening 110 of the protective layer 18, solder barrier layers 15 are formed in coating states.