Title:
BOOT AND BAND ASSEMBLING DEVICE
Document Type and Number:
Japanese Patent JP3175605
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To position and incline a band with high accuracy when assembling a boot and the band and mechanize boot and band assembling work.
SOLUTION: A boot and band assembling device 10 is provided with a base 15, turn table 20, workpiece holding section 30, small diameter band holding section 50, large diameter band banding mechanism 60 and small diameter band bending mechanism 70. The turn table 20 can move while rotating between a workpiece supply position 8a and a workpiece mounting positions 8b. The workpiece holding section 30 is provided with a bending guide 38a, which can hold a boot 1 and a large diameter band and controls the bending piece of the large diameter band. The small diameter band holding section 50 has a stopper section 57, which can hold a small diameter band and control the bending piece of the small diameter band. The large diameter band bending mechanism 60 has a first operation section 64 for bending the bending piece of the large diameter band, and the small diameter band bending mechanism 70 has a second operation section 74 for bending the bending piece of the small diameter band.
Inventors:
Takashi Eguchi
Yasuhisa Shirakami
Yasuhisa Shirakami
Application Number:
JP26991496A
Publication Date:
June 11, 2001
Filing Date:
October 11, 1996
Export Citation:
Assignee:
MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA
International Classes:
B23P19/04; B23P21/00; B62D1/20; (IPC1-7): B23P21/00; B23P19/04; B62D1/20
Domestic Patent References:
| JP7256527A | ||||
| JP9254917A | ||||
| JP6232728U | ||||
| JP2104929U |
Attorney, Agent or Firm:
Takehiko Suzue (3 outside)