Title:
粒子状ポリ（フェニレンエーテル）含有ワニス組成物、複合材、それから調製したラミネート、および複合材の製造方法
Document Type and Number:
Japanese Patent JP6742304
Kind Code:
B2
Abstract:
A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.
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Inventors:
Takin-Tas, Irem
Peters, Edward, Norman
Peters, Edward, Norman
Application Number:
JP2017519868A
Publication Date:
August 19, 2020
Filing Date:
September 24, 2015
Export Citation:
Assignee:
Subic Global Technologies Besloten Fennaught Shap
International Classes:
C08J5/04; C08L71/12; C08K5/3477; C08L9/00; C08L63/00; C08L79/04
Domestic Patent References:
| JP2008050526A | ||||
| JP58069046A | ||||
| JP2013194137A |
Foreign References:
| WO2008094796A1 | ||||
| WO2004104097A1 | ||||
| US20140005340 |
Attorney, Agent or Firm:
Sakaki Morishita