PURPOSE: To obtain a varnish having excellent heat-resistance and useful as a heat-resistant coating agent, heat-resistant ink, heat-resistant fiber, etc., by dissolving a resin composition composed of an alkenylphenol compound and a maleimide compound in an organic solvent.
CONSTITUTION: This varnish is produced by dissolving a resin composition composed of (A) an alkenylphenol compound having ≥2 alkenyl groups in one molecule {e.g. 3,3'-bis(2-propenyl)-4,4'biphenyldiol, 2,2-bis[4-hydroxy-3-(2 propenyl)phenyl]propane, 2,3-bis(2-propenyl)-1,4-benzenediol, etc.} and (B) a maleimide compound having ≥2 maleimide groups in one molecule (preferably bismaleimide, trismaleimide or a polymaleimide) in (C) an organic solvent. The amount of the component A is preferably 10-500 pts.wt. based on 100 pts.wt. of the component B. The varnish may further be incorporated with an epoxy resin and an epoxy resin hardener.
TAKEI MASAO
KIMURA KAORU
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