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Title:
VEHICLE BUMPER, AND MOLDING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2012166634
Kind Code:
A
Abstract:

To provide a vehicle bumper and a molding method thereof capable of thinning a thickness and reducing weight by suppressing the generation of a weld line caused by injection molding.

The vehicle bumper includes a molding fitting groove 4 over the bumper side 3 from the bumper center 2, and its groove bottom is formed with a fastening hole 5 for pressing in and fitting a clip 7 of a side molding 6. In the injection molding of a rear bumper 1, a plate thickness Tc of the bumper center 2 in which gates G1-G3 are concentrated is reduced, and the generation of the weld line can be suppressed by increasing a meeting angle of a molten resin around a movable core of forming the fastening hole 5 by molding in the different plate thickness distribution of increasing a plate thickness Ts of the bumper side 3.


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Inventors:
KUGAYA TAKUJI
WAKAMATSU KAZUNORI
TAKATSU RYOICHI
SEKIGUCHI ATSUSHI
SHIMIZU MASAYOSHI
NAKAGAKI HITOSHI
ASHIDA TAKASHI
KAMAE KOSUKE
OTSUBO TAKENOBU
Application Number:
JP2011028080A
Publication Date:
September 06, 2012
Filing Date:
February 14, 2011
Export Citation:
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Assignee:
NISSAN MOTOR
International Classes:
B60R19/04; B29C45/00; B29C45/27; B29C45/37; B60R19/03; B29L31/30
Domestic Patent References:
JPH09131761A1997-05-20
JPS6198650A1986-05-16
JPS63233814A1988-09-29