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Patent Searching and Data


Title:
PACKAGE FOR HOUSING ELECTRONIC PART
Document Type and Number:
Japanese Patent JPH0637195
Kind Code:
A
Abstract:

PURPOSE: To make electronic parts to normally and stably operate for a long period by preventing the scattering and adhesion of solder used as a sealing material to electronic parts housed in the title package.

CONSTITUTION: A first metallic layer 8 with which an insulating substrate 1 is coated and second metallic layer 9 with which a cap body 2 is coated are prevented from being exposed in the space of the title package for housing electronic parts. In addition, either one of the layers 8 and 9 is provided 0.2mm apart from the space for housing electronic parts. Because of this distance, partial scattering of a sealing material 10 inside the container 4 composed of the substrate 1 and cap body 2 through the layers 8 and 9 and malfunctions of the electronic parts caused by the material 10 adhering to the parts can be prevented when the cap body 2 is joined to the substrate 1 with the material 10 and the electronic parts are airtightly sealed in the container 4. Therefore, the electronic parts can be made to normally and stably operate for a long period.


Inventors:
NISHI KOJI
YOSHIDA SADAKATSU
MIYAWAKI KIYOSHIGE
Application Number:
JP18697992A
Publication Date:
February 10, 1994
Filing Date:
July 14, 1992
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H01L23/02; (IPC1-7): H01L23/02